产品展示
Sputtering System
装载系统
개요
- Carrier结合/分离基板,为工程投入和排出增压设备的载运系统
특징
- 基板 - 水平返还及垂直转换, Carrier - 垂直退货
根据使用量自动更换Carrier System
采用非接触发送系统,最大程度地减少Particle
Simulation 采用连接优化的设计,尽量减少结构物的下垂量 (Max 0.1mm)
사양
Size of substrate response
Max 2,940 X 3,370mm (G10.5)
Tact Time: Equal Accuracy based on deposition equipment
Level Accuracy: ≤±1mm / Index Repetability: ≤±0mm
Configuration
Glass Loader/Unloader, Glass Handling Robot, Carrier Station, Transfer Station, Magazine, Safety Fence